Reactive Polyimide GPI series
Polyimide is known to have excellent heat resistance and mechanical properties. However it is also true that Polyimide has some difficulties regarding workability due to its insolubility and non-melting factors.
GPI is solution for the above-mentioned problem. In addition GPI add new functions, then you can spread your imagination by using this GPI.
Features
- The chemical structure of GPI has already circularized, so it is superior in preservation stability. You can preserve at normal temperature.
- GPI has high solubility for various solvents
- You can easily produce film on various type of materials, such as plastics or metals.
- The phenolic hydroxyl group in chemical structure brings almost same reactivity as usual phenolic resins even polyimide shows lower reactivity.
- High heat resistance
- High adhesion on film
- High water resistance
- Easy preservation
- Easy workability
- Easy modifications
Preservation stability
Circularized structure brings it to preserve easily at room temperature.
Solvent solubility
GPI has high solubility for various solvents.
Solvent type | Name of solvents |
---|---|
Containing Nitrogen | NMP, DMF, DMAC |
Ketone | MEK, MIBK, Cyclohexanone |
Alcohol | Benzylalcohol, BC |
Others | THF, Phenol, BCA |
Film workability
GPI can dry at temperature of Boiling Point of above-mentioned solvents. For example, in the case of MIBK solution, you can easily dry the film at 120℃ on the PET film.
And GPI film shows high adhesion then heat pressure lamination is possible on various materials.
Ability of the modification
The phenolic hydroxyl group in GPI structure brings almost same reactivity as usual phenolic resins.
That’s why GPI reacts with general epoxy resins as shown below.
Line up of GPI series
item | unit | GPI-NT | GPI-HT | GPI-LT | GPI-LM |
---|---|---|---|---|---|
Type | Non-Thermoplastic | High heat resistance | High elongation | Low elastic modulus | |
Non-volatile | % | 20 | 30 | 35 | 40 |
Solvent type | - | NMP DMAC THF |
MEK MIBK Cyclohexznone |
MIBK Cyclohexznone |
MIBK BC BCA Cyclohexznone |
Prevention condition | ℃ | ≦ 25 | ≦ 25 | ≦ 25 | ≦ 25 |
T.g. | ℃ | - | 200 | 150 | 55 |
5% Thermal decomposition |
℃ | 405 | 410 | 445 | 410 |
Elastic modulus | GPa | 2.0 | 1.0 | 0.5 | 0.005 |
Peel adhesive | N/cm | 11 | 14 | 18 | 11 |
Elongation | % | 4.0 | 7.0 | 200 | 315 |
Water absorption (121℃/24hours) |
% | 0.9 | 0.9 | 0.8 | 0.7 |
We can provide not only the above-mentioned products,
but your required products if we can develop.
Please contact us to order for more information.